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BGA REFLOW TEMPERATURE MANUAL
BGA REFLOW TEMPERATURE SOFTWARE
BGA REFLOW TEMPERATURE SERIES

Record the nozzle part number, BGA component height, and circuit board thickness on BGA Rework Process Worksheet. The nozzle should fit over BGA component with minimal gap. The nozzle part number should correspond to BGA physical size.

Select the BGA rework nozzle that will be used to develop the BGA rework profile.

Temperature adjustments may be required when processing components soldered using higher temperature lead-free solders. This procedure references temperatures used when processing BGA components soldered using tin-lead solders.

Near, or surrounded by, a ground plane.

Closest to the edge of the circuit board.

The most difficult BGA components to rework will generally be: The BGA component location to select for the profile should be the one that will generally be the most challenging to rework. If the circuit board has multiple BGA component locations that require profiles, and all the BGA components are the same type and size, one rework profile may be used for all. Profiles developed on one Air-Vac machine are portable, and may be transferred to other Air-Vac machines. Allow the circuit board and BGA rework machine to cool naturally.

BGA REFLOW TEMPERATURE SOFTWARE

Doing so may interfere with the software program. Avoid the use of fans to cool the circuit board or BGA rework machine during Profile Development. Prior to starting the profile development process both the BGA Rework machine and the circuit board should be at, or near, room temperature.

Read and understand all instructions that accompany each project prior to starting. The method uses an automatic repetition procedure, using information learned from previous runs to optimize the process. The Smart Track method automatically adjustments heater temperature, gas flow rates, and duration on a real-time basis. However, profile development circuit boards may be subjected to multiple thermal cycles. The Smart Track profile development method is non-destructive since drilling holes to embed thermocouples is eliminated. These may include board temperature, soak duration, BGA package temperature, BGA package ramp rate, solder joint temperature, and time over reflow.

This procedure automatically creates a thermal profile based on user-defined target parameters.

BGA REFLOW TEMPERATURE SERIES

If a series of circuit boards are to be reworked, the first several should be handled with extreme care until a reliable procedure is established. Copper delamination, separation of pads, barrels of inner layers.Įach circuit board must be treated individually and scrutinized carefully for its reaction to heat. When subjected to the high temperatures they are susceptible to the following types of damage:Ģ. Carefully evaluate pre bake requirements.Ĭircuit boards are fabricated from a wide variety of materials. Plastic BGA's are especially sensitive to moisture absorption. Evaluate the component's tolerance to heat prior to using this method. This method may subject the component to extreme temperatures.

BGA REFLOW TEMPERATURE MANUAL

Consult the equipment manual for more information. 2" from edge of BGA component being profiled.Ī thorough review of the equipment manual and comprehensive training are mandatory. Figure 4: Position the IR Sensor Thermocouple #1 approx.